OEM PCBA Clone Assembly Service Zina PCB & PCBA Mwambo Zamagetsi PCB Circuit Board

Kufotokozera Kwachidule:

Ntchito: Azamlengalenga, BMS, Kuyankhulana, Computer, Consumer Electronics, chipangizo chapanyumba, LED, Medical Zida, Motherboard, Smart electronics, Wireless charger

Mbali: FExible PCB, High kachulukidwe PCB

Zida Zoyimitsa: Epoxy Resin, Zitsulo Zophatikiza Zitsulo, Organic Resin

Zida: Aluminium Yokutidwa ndi Copper Foil Layer, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Paper Phenolic Copper Foil Substrate, Synthetic Fiber

Ukadaulo Wopangira: Kuchedwetsa Kupanikizika Kwambiri, Chojambula cha Electrolytic

Titumizireni imelo

Tsatanetsatane wa Zamalonda

Zolemba Zamalonda

Kufotokozera

PCB Technical Capacity

Zigawo Kupanga kwamisa: 2 ~ 58 zigawo / Kuyendetsa koyendetsa: 64 zigawo

Max. Makulidwe Kupanga kwakukulu: 394mil (10mm) / Oyendetsa ndege: 17.5mm

Zida FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Lead free msonkhano zinthu), Halogen-Free, Ceramic wodzazidwa, Teflon, Polyimide, BT,PPO,PPE, Hybrid, Partial wosakanizidwa, etc.

Min. M'lifupi/Mpata Wosanjikiza Wamkati: 3mil/3mil (HOZ), Wosanjikiza wakunja: 4mil/4mil(1OZ)

Max. Makulidwe a Copper 6.0 OZ / Pilot run: 12OZ

Min. Bowo Kukula Kwamakina kubowola: 8mil(0.2mm) Laser kubowola: 3mil(0.075mm)

Pamwamba Malizani HASL,Kumiza Golide, Tini Yomiza, OSP, ENIG + OSP, Kumiza, ENEPIG, Chala Chagolide

Njira Yapadera Bowo Lokwiriridwa, Bowo Lakhungu, Kukaniza Kophatikizidwa, Mphamvu Zophatikizidwa, Zophatikiza, Zosakanizidwa Mwapang'ono, Kachulukidwe Kwambiri, Kubowola Kumbuyo, ndi Resistance control

PCBA luso luso

Ubwino -----Katswiri Wokweza Pamwamba ndi Kudulira-bowo ukadaulo wa soldering

----Kukula kosiyanasiyana ngati ukadaulo wa 1206,0805,0603 wa SMT

----ICT(In Circuit Test),FCT(Mayeso Ogwira Ntchito)

---- PCB Assembly Ndi UL, CE, FCC, Rohs Chivomerezo

----Ukadaulo wa nayitrogeni wa gasi wothira mafuta a SMT.

----High Standard SMT&Solder Assembly Line

-----Kuchuluka kwaukadaulo kolumikizana ndi ma board.

Components Passive Down to 0201 size, BGA ndi VFBGA, Leadless Chip Carriers/CSP

Msonkhano wa SMT wa mbali ziwiri, Fine Pitch to 0.8mils, BGA kukonza ndi Reball

Kuyesa Flying Probe Test, X-ray Inspection AOI Test

Kulondola kwa malo a SMT	20 umm
Kukula kwa zigawo	0.4×0.2mm(01005) -130×79mm, Flip-CHIP, QFP, BGA, POP
Max. chigawo kutalika	25 mm
Max. PCB kukula	680 × 500 mm
Min. PCB kukula	palibe malire
PCB makulidwe	0.3 mpaka 6 mm
Wave-Solder Max. Mtengo wa PCB	450 mm
Min. Mtengo wa PCB	palibe malire
Chigawo kutalika	Pamwamba 120mm/Bot 15mm
Mtundu wa Metal Sweat-Solder	gawo, lonse, inlay, mbali
Zida zachitsulo	Copper, Aluminium
Pamwamba Pamwamba	plating Au, , plating Sn
Mpweya wa chikhodzodzo	zosakwana 20%
Press-fit Press range	0-50KN
Max. PCB kukula	800x600mm