| Kalasi Yabwino | •Sindi IPC 2-3 |
| Assembly Technology | • Zolemba za SMD •Kupanga PCB • Msonkhano wa SMT PCB • THTmsonkhano • Msonkhano wa Chingwe ndi Waya • ZogwirizanaKupaka • User Interface Assemblies • Kupanga BokosiMsonkhano • Chomalizamankhwala msonkhano |
| Utumiki Wowonjezera Mtengo | • Kupeza zigawo • Kulongedza ndi kutumiza • DFM • Kupakira ndikutumiza • Chitsanzo cha PCBA • Yankhaninso • IC Programming • Lipoti la NPI |
| Zitsimikizo za Kampani | • ISO9001 • IATF16949 • ISO13485 • 14001 |
| Zitsimikizo Zazinthu | • UL • RoHS • SGS • FIKIRANI |
| Kutha Kuyitanitsa | • Palibe zofunikira za MOQ (Minimum Order Quantity) |
| Njira Yoyesera | QC yoyendera pamanja SPI(Kuwona kwa Solder Paste)X-ray • FAI (nkhani yoyamba kuyendera) ICT FCT Kukalamba kuyesa Kudalirika |
| Chithunzi cha FOB Port | Shenzhen |
| Kulemera pa Unit | 150.0 gm |
| HTS kodi | 3824.99.70 00 |
| Tumizani Katoni Miyezo L/W/H | 53.0 x 29.0 x 37.0 Masentimita |
| Nthawi yotsogolera | 14-21 masiku |
| Makulidwe pa Unit | 15.0 x 10.0 x 3.0 Masentimita |
| Mayunitsi pa Katoni Yotumiza kunja | 100.0 |
| Tumizani Kulemera kwa Carton | 13.0 kg |