| Zigawo | 1-2 Zigawo |
| Anamaliza Makulidwe | 16-134mil (0.4mm-3.4mm) |
| Max. Dimension | 500mm * 1200mm |
| Makulidwe a Copper | 35um, 70um, 1 mpaka 10oZ |
| Min Line Width/Space | 4mil (0.1mm) |
| Min Finished Hole Kukula | 0.95 mm |
| Min. Kubowola Kukula | 1.00 mm |
| Max. Kubowola Kukula | 6.5 mm |
| Anamaliza Kulekerera Kukula kwa Hole | ± 0.050mm |
| Aperture Position Precision | ± 0.076mm |
| Min SMT PAD Kukula | 0.4mm ± 0.1mm |
| Min.Solder Mask PAD | 0.05mm (2mil) |
| Min.Solder Mask Cover | 0.05mm (2mil) |
| Solder chigoba Makulidwe | > 12um |
| Kumaliza Pamwamba | HAL, HAL Lead yaulere, OSP, Immersion Gold, etc |
| HAL makulidwe | 5-12 pm |
| Kumiza Golide Makulidwe | 1-3 mil |
| Makulidwe a Mafilimu a OSP | ENTEK PLUS HT: 0.3-0.5um; F2: 0.15-0.3um |
| Kumaliza kwa Outline | Njira & kukhomerera; Kupatuka kolondola ± 0.10mm |
| Thermal Conductivity | 1.0 mpaka 12w/mk |
| Chithunzi cha FOB Port | Shenzhen |
| Tumizani Katoni Miyezo L/W/H | 36 x 26 x 25 Masentimita |
| Nthawi yotsogolera | 3-7 masiku |
| Mayunitsi pa Katoni Yotumiza kunja | 5.0 |
| Tumizani Kulemera kwa Carton | 18 kg |